<span class="sans-serif">Simulating silicon thermal oxidation with the hybrid MD</span> <span class="sans-serif">+</span> <span class="sans-serif">tfMC approach</span>

· · 来源:tutorial资讯

Алевтина Запольская (редактор отдела «Бывший СССР»)

That’s another well established pattern in Modular Design. It’s about putting together code that is highly related to each other and by implication separating unrelated code into other modules. High Cohesion discourages spreading the knowledge (e.g. of particular logic) among many modules, because it increases complexity and cognitive load. It’s easier to reason about the code that is closer to each other than scattered throughout the system (coupling inside the module is not such a problem).

Apple пере,这一点在爱思助手下载最新版本中也有详细论述

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Inside Pea